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this is information on a product in full production. may 2013 docid15200 rev3 1/16 16 SPT01-335DEE automation sensor transient and overvoltage protection datasheet ? production data figure 1. spt01-335 configuration diagram figure 2. spt01-335 bottom view features ? triple diode array for power bus protection, switch protection and reverse blocking protection ? flexible connection for npn low side or pnp high side sensor configuration ? 6 v to 36 v supply voltage range ? stand-off voltage: 36 v ? minimum breakdown voltage v br : 38 v ? 8/20 s 2a maximum clamping voltage: 46 v ? direct sensor switch current: 300 ma ? blocking diode drop forward voltage v f : 1 v at 300 ma ? blocking diode maximum 10 ms square pulse current i fsm : 1 a ? ambient temperature: -40 c to +100 c ? qfn3x3-6l 1 mm flat package: 3x3 mm ? voltage surge: en 60947-5-2 or iec 61000-4-5 with r cc = 500 : 1 kv ? electrostatic discharge esd, iec 61000-4-2: 8 kv in contact, 15 kv in air ? electrical transient i mmunity, iec 61000-4-4: 2 kv benefits ? compliant for interface with logic input type 1, 2 and 3 iec 61131-2 standard ? recommended to protect any 3-wire sensor compliant with en 60947-5-2 standard ? highly compact with integrated power solution in smd version applications ? factory automation sensor application ? proximity sensor interface protection ? transient and surge voltage protection ? compliant with sensor standard, en60947-5-2 qfn 3x3 6+3 lead spt01-235dee ls d3 v+ v- hs d1 d2 k a ls d3 v+ v- hs d1 d2 k a d1 d2 d3 v+ hs a hs v - a ls v+ k 1 4 d1 d2 d3 d1 d2 d3 v+ hs a hs v - a ls v+ k 1 4 v+ hs a hs v - a ls v+ k 1 4 www.st.com
description SPT01-335DEE 2/16 docid15200 rev3 1 description the spt01-335 is specifically designed for the protection of 24 v proximity sensors. it implements the reverse polarity and the overvo ltage protection of the sensor power supply and the power switch overvoltage protection. it provides a very compact and flexible solu tion offering two connections for pnp or npn sensors as shown in figure 8 and figure 9 . thanks to high performance st technology, the spt01-335 protects the proximity sensor to the highest level compliant with iec 61000-4-2, iec 61000-4-4 and iec 60947-5-2 / iec 61000-4-5 standards.
docid15200 rev3 3/16 SPT01-335DEE characteristics 2 characteristics table 1. pinout connections (see figure 2 ) pin # name description exposed pad aligned with pins 1 and 6 l s d1 power bus protection diode cathode 1, 6 hs d1 power bus protection diode anode 5, exposed pad aligned with pins 2 and 5 v+ d2 sensor switch protection diode cathode; pin 5 internally connected to mid pad 2 v- d2 sensor switch protection diode anode exposed pad aligned with pins 3 and 4 k d3 reverse blocking protection diode cathode 3, 4 a d3 reverse blocking protection diode anode table 2. absolute ratings (t amb = 25 c) symbol diode parameter value unit v pp all esd protection, iec 61000-4-2, per diode, in air (1) 1. see system oriented test circuits in figure 11 (esd) and figure 10 (surge as also described in iec 60947-5-2). 15 kv esd protection, iec 61000-4-2, per diode, in contact (1) 8kv v pp all peak surge voltage, iec 61000-4-5, per diode, r cc = 500 , (1) 1kv i pp all peak pulse forward and reverse current, t p = 8/20 s 2 a p pp all peak pulse power dissipation, t j = t amb = 100 c, t p = 8/20 s 100 w i fsm all maximum forward surge current, t p = 10 ms square 1 a e ar d1 maximum repetitive avalanche energy l = 1 h, i ras = 0.3 a, r s = 100 , v cc = 30 v,t amb = 85 c (1) 60 mj t j all storage junction temperature range - 40 to 175 c table 3. recommended operating conditions symbol parameter value unit v cc operating power bus supply voltage -30 to 36 v pulse repetitive voltage t p = 0.5 s, r cc = 500 -30 to 35 v i f d3 forward peak current t j = 150 c duty cycle = 50% 300 ma t amb operating ambient temperature range -40 to 100 c t j operating junction temperature range (1) 1. extended from dc operating at 150 c up to peak repetitive value during the inductive load demagnetization -40 to 175 c
characteristics SPT01-335DEE 4/16 docid15200 rev3 table 4. electrical characteristics (t j = 25 c, unless otherwise specified) symbol diode name test conditions value unit v rm all reverse stand off voltage (1) 1. reverse stand-off voltage is valid for ambien t temperature within the operating temperature range. i r = 0.2 a min 33 v i r = 1 a min 36 v i rm all leakage reverse current v rm = 33 v max 0.2 a v rm = 33 v, t j = 150 c max 1 a v br all reverse breakdown voltage i r = 1 ma min 38 v typ 41.4 v v cl all peak clamping voltage i pp = 2 a, t p = 8 /20 s max 46 v typ 44 v r d all 8/20s dynamic resistance typ 0.5 tallv br temperature sensitivity max 10 10 -4 /c v cl d1 peak clamping voltage i r = 0.3 a, l = 1 h, t p = 8 /20 s, v cc = 30 v max 46 v v f d3 forward drop voltage i f = 300 ma max 1 v table 5. thermal resistance symbol parameter value unit r th(j-a) smd thermal resistance junction to ambient, per diode fr4 board, copper thickness = 35 m, s cu = 0.85 mm2 330 c/w z th(j-a) smd thermal transient impedance junction to ambient, per diode t p = 15 ms, t amb = 85 c, s cu = 0.85 mm2 20 c/w
docid15200 rev3 5/16 SPT01-335DEE characteristics figure 7. relative variation of thermal impedance junction to ambient versus pulse duration (printed circuit board) figure 3. relative variation of peak pulse power versus initial junction temperature figure 4. peak pulse power versus exponential pulse duration (typical values) p pp [t j initial] / p pp [t j initial=25c] ,0.0 ,0.1 ,0.2 ,0.3 ,0.4 ,0.5 ,0.6 ,0.7 ,0.8 ,0.9 ,1.0 ,1.1 0 25 50 75 100 125 150 175 200 tj( c) t j (c) p(w) pp 1 10 100 1000 10000 10 100 1000 t (s) p t = 25 c jinitial figure 5. clamping voltage versus peak pulse current (typical values) figure 6. forward voltage drop versus peak forward current (typical values) i (a) pp 0.01 0.1 1 10 41 41.5 42 42.5 43 43.5 44 44.5 v cl (v) wave 8/20 s - t initial = 25 c j i (a) fm 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 0.2 0.4 0.6 0.8 1 1.2 175 c 150 c 2 5 c - 25 c v (v) fm z t h ( j -a) /r t h ( j - a) 0.01 0.10 1.00 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 t p (s)
spt01-335 basic application SPT01-335DEE 6/16 docid15200 rev3 3 spt01-335 basic application figure 8. pnp high side sensor configuration figure 9. npn low side sensor configuration note: it is advised to use diodes d1 and d3, whic h are the external devices in the package, as switch overvoltage protection and power supply reverse polarity protection since they allow better cooling design with pcb pad implementation. d2, the middle diode, can be dedicated to the power supply overvoltage protection because it would run only in pulse mode with basic pcb pad footprint. table 6. spt01-335 pin connection versus sensor output stage configuration as shown on figure 8. and figure 9 sensor type spt01-335 terminal connection ls hs a k v+ v- pnp to v s+ sensor hs v cc to v s+ sensor v s+ sensor v s- npn sensor ls to v s- to v s- to g n d v cc gnd gnd input load v s+ ls hs v s- sensor output a v+ d3 d1 d2 v- hs k ls v cc gnd gnd load v s+ ls hs v s- v s+ ls hs v s- v s+ ls hs v s- a v+ d3 d1 d2 v- hs k ls p.supply ls hs v s- v s+ sensor output stage gnd load p.supply input ls d3 d2 v+ v- k hs a ls hs v s- v s+ sensor output stage ls hs v s- v s+ sensor output stage ls hs v v s+ ls hs v v s+ sensor output stage gnd load gnd load gnd load ls d3 v+ v- k hs a ls d3 d1 v+ v- k hs a v cc v cc
docid15200 rev3 7/16 SPT01-335DEE system related electromagnetic compatibility ratings 4 system related electromagnetic compatibility ratings refer to table 3 for test performance. figure 10. surge voltage test circuit according to iec 61000-4-5 with 500 serial resistor figure 11. esd test circuit according to ie 61000-4-2 diode under test r = 2 c = 18 f pe = 500 w high voltage surge generator r cc w esd voltage source esd generator diode under test r = 330 c = 150 pf
evaluation of the clamping voltage SPT01-335DEE 8/16 docid15200 rev3 5 evaluation of the clamping voltage v br (t j ) = v br (25) x (1+ t (t j ? 25)) v cl max (8/20 s) = v br max + r d x i pp 5.1 application considerations 5.1.1 demagnetization of an inductive lo ad driven by the switch protection diode the turn off energy e off that could be dissipated in the d 1 diode is calculated as shown in an587 and an1351 application notes: e off = v br x l x [v cc + (v cc - v br ) x ln (v br / (v br - v cc ))] / (r s )2 t off = l x ln (v br / (v br - v cc )) / r s p off = e off / t off with l = 1 h; i = 0.3 a; v br = 39 v; v cc = 30 v, r s = 100 the stress withstood by d 1 becomes: e off = 65 mj; t off = 15 ms; p off = 4.3 w in a single pulse mode operation, the junc tion temperature can be fairly estimated: t j = t amb + [z th (t off ) x p off ] in a repetitive operation with an f repetitive rate, p av = e off x f t (j_av) = t amb + p av x r th(j-a) and during the demagnetization t off , t j_pk < t j_av + p off x z th (t off ) z th is the transient thermal impedance of each diode for a pulse having a duration t off . figure 12. electrical diagram for inductive load demagnetization load d3 d1 v cc v br r l load switch r s
docid15200 rev3 9/16 SPT01-335DEE evaluation of the clamping voltage 5.1.2 life time considerations life time of the product is calculated to exceed 10 years. the key parameters to consider are the ambient temperature (t amb < 100 c), the power supply voltage (v cc < 30 v), and the current in the reverse blocking diode (i f = 0.1 a switching at 0.5 hz with 50% duty cycle, the stand-by current being less than 1.5 ma). for higher current or higher switching frequency operation, the life time should be calculated considering the peak and average junction temperature. this junction temperature can be reduced by reducing the thermal resistance of the clamping diode, d 1 normally. this can be done by increasing its pcb copper tab surface s cu .
package information SPT01-335DEE 10/16 docid15200 rev3 6 package information ? epoxy meets ul94,v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark. figure 13. qfn 3x3 package dimension definitions index area top view bottom view side view pin#1 id d a1 a e e b1 b e2 l1 d2 l k1 k 3 4 1 6
docid15200 rev3 11/16 SPT01-335DEE package information figure 14. qfn 3x3 footprint (mm) table 7. qfn 3x3 package dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.80 0.90 1.00 0.031 0.035 0.039 a1 0.00 0.02 0.05 0.0007 b 0.35 0.40 0.45 0.013 0.015 0.017 b1 0.2 0.007 d 2.95 3.00 3.05 0.116 0.118 0.12 d2 0.35 0.50 0.60 0.013 0.019 0.023 e 2.95 3.00 3.05 0.116 0.118 0.12 e2 1.55 1.70 1.80 0.06 0.066 0.07 e 0.95 0.037 k 0.20 0.007 k1 0.45 0.017 l 0.22 0.33 0.43 0.008 0.012 0.016 l1 0.11 0.004 0.3 0.95 1.70 0.5 0.4 0.32 0.53 0.20
recommendation on pcb assembly SPT01-335DEE 12/16 docid15200 rev3 7 recommendation on pcb assembly 7.1 stencil opening design 1. general recommendation on stencil opening design a) stencil opening dimensions: l (length), w (width), t (thickness). figure 15. stencil opening dimensions b) general design rule stencil thickness (t) = 75 ~ 125 m 2. reference design a) stencil opening thickness: 100 m b) stencil opening for central exposed pad: opening to footprint ratio is 50%. c) stencil opening for leads: opening to footprint ratio is 90%. figure 16. recommended stencil window position l t w aspect ratio w t ----- 1,5 = aspect area lw 2t l w + () --------------------------- - 0,66 = 0.3 0.354 0.329 0.014 0.011 0.379 0.95 1.70 1.202 0.5 0.073 0.044 0.4 0.32 0.53 0.20 0.032 2.249 0.141 0.503
docid15200 rev3 13/16 SPT01-335DEE recommendation on pcb assembly 7.2 solder paste 1. halide-free flux qualification ro l0 according to ansi/j-std-004. 2. ?no clean? solder paste is recommended. 3. offers a high tack force to resist component movement during high speed. 4. solder paste with fine particles: powder particle size is 20-45 m. 7.3 placement 1. manual positioning is not recommended. 2. it is recommended to use th e lead recognition ca pabilities of the placement system, not the outline centering. 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy , a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of th e pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 7.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away.
recommendation on pcb assembly SPT01-335DEE 14/16 docid15200 rev3 7.5 reflow profile figure 17. st ecopack ? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 250 0 50 100 150 200 240 210 180 150 120 90 60 30 300 270 - 6c/s 240-245 c 2 - 3 c/s temperature (c) -2 c/s -3 c/s time (s) 0.9 c/s 60 sec (90 max)
docid15200 rev3 15/16 SPT01-335DEE ordering information 8 ordering information figure 18. ordering information scheme 9 revision history table 8. ordering information order code marking package weight packing SPT01-335DEE sp1 qfn 3x3 22.71 mg tape and reel spt 01 - 3 35 dee sensor protection termination generation 01 = first generation channels number 3 = 3 channels 35 = 36 v minimum package dee = qfn-9l stand-off voltage table 9. document revision history date revision changes 21-nov-2008 1 first issue 19-mar-2012 2 added ul statement in chapter 6 03-may-2013 3 updated features, table 3 , table 4 , figure 17 and figure 18 .
SPT01-335DEE 16/16 docid15200 rev3 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not authorized for use in weapons. nor are st products designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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